Epoksi kalıplama birikmasi (EMC) LED chiplari/paketlari yuqori darajada integratsiyalashgan, aks ettiruvchi korpusni hosil qilish uchun to'g'ridan-to'g'ri mis qo'rg'oshin ramkasiga qoliplangan termoset epoksi qatronidan foydalanadigan SMD{0}}uslubidagi ilg'or qadoqlash texnologiyasidir. An'anaviy PPA (termoplastik) paketlardan farqli o'laroq, EMC yuqori issiqlikka chidamlilik, UV barqarorligi va mexanik kuch bilan ta'minlaydi, bu esa uni o'rta{2}}to-yuqori-quvvat ilovalari uchun ideal qiladi.
The core structure includes a semiconductor LED die (typically InGaN for blue emission) bonded to a silver-plated copper substrate via die-attach adhesive for excellent thermal and electrical conductivity. Gold or alloy wire bonds connect the die to the leadframe electrodes. A phosphor layer (e.g., YAG:Ce) converts blue light to white or desired spectra. The entire assembly is encapsulated in white EMC-a blend of epoxy resin, hardeners, high-reflectivity fillers (TiO₂, SiO₂), and additives-forming a reflective cup and protective body with >440 nm da 90% aks ettirish.
EMC ning termosetting tabiati yuqori samaradorlik, past CTE nomuvofiqligi va mukammal havo o'tkazmasligi uchun MAP (qoliplangan massiv paketi) qoliplarini qo'llash imkonini beradi. Umumiy spetsifikatsiyalarga 3030/5050/7070 oʻlchamlar, 1–3 Vt quvvat koʻrsatkichlari (yoki koʻp chipli variantlarda undan yuqori), termal qarshilik kiradi<8°C/W, operating temperatures up to 125°C junction, CRI 80–95, and lifespans >50,000 hours. It excels in automotive, outdoor, and high-lumen lighting due to solder-heat resistance (>260 daraja) va past MSL.
